| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component package with high rigidity and ductility at a high temperature of 80°C. SOLUTION: The electronic component package is formed of a sheet which exhibits a tensile modulus of 0.3 GPa or more and a tensile elongation at break of 300% or higher in a tensile test at 80°C. The sheet is made of a polymer alloy consisting of a blend of at least polybutylene terephthalate resin and polycarbonate resin. Ingredients constituting the polymer alloy form, on the surface of the electronic component package, a bi-phase continuous structure with a structural period of 0.001-5μm or a covariance structure with an interparticle distance of 0.001-5μm. COPYRIGHT: (C)2007,JPO&INPIT
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