发明名称 COATING APPARATUS OF ELECTRIC OR ELECTRONIC CIRCUIT BOARD AND COATING METHOD USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To achieve miniaturization and the contraction of an installation space by a simple mechanism and structure and to enhance productivity and economy. SOLUTION: A plate-shaped object 100 to be coated is positioned between a pair of the nozzle units 4, 4, which are arranged in the coating space 3 of a coating booth 2 in mutually opposed relationship, in a suspended state to be fed and a coating agent A is ejected from a plurality of spray nozzles 5 arranged to the nozzle units at an equal interval in one row to be applied to both surfaces of the plate-shaped object 100 to be coated while the plate- shaped objecgt 100 to be coated is moved in the direction X crossing the arranging direction of the spray nozzles 5 at a right angle.</p>
申请公布号 JP2000334342(A) 申请公布日期 2000.12.05
申请号 JP19990145436 申请日期 1999.05.25
申请人 KEMUTETSUKU JAPAN:KK 发明人 YANAGIDA KAZUYO
分类号 B05D1/02;B05B13/02;B05B15/12;H05K3/00;H05K3/28;(IPC1-7):B05B13/02 主分类号 B05D1/02
代理机构 代理人
主权项
地址