| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin film metal conductive line capable of preventing the occurrence of voids or seams and preventing undercut phenomena at the time of etching, when the thin film metal conductive line is manufactured, and to provide a method for manufacturing the same. <P>SOLUTION: The method for manufacturing the thin film metal conductive line includes: a step of forming a seed metal layer on a substrate; a step of forming a first photoresist layer on the seed metal layer and forming a metal conductive line pattern using the first photoresist layer as a mask; a step of forming a second photoresist layer with a certain spacing, especially 0.1 to 2μm, from the metal conductive line pattern after removing the first photoresist layer; a step of forming a passivation film enclosing the metal conductive line by using electrolytic plating; and a step of etching to remove exposed portions of the seed metal layer after removing the second photoresist layer. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
