发明名称 |
METHOD AND ARRANGEMENT FOR BOARD-TO-BOARD INTERCONNECTION |
摘要 |
A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side. |
申请公布号 |
US2016249447(A1) |
申请公布日期 |
2016.08.25 |
申请号 |
US201315031369 |
申请日期 |
2013.11.01 |
申请人 |
TELEFONAKTIEBOLAGET L M ERICSSON (PUBL) |
发明人 |
ZHOU Bo;CHEN Junyou;LIU Kun |
分类号 |
H05K1/02;H05K1/14;H05K3/46;H01P3/08;H05K3/10 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A wide bandwidth circuit board arrangement including two coplanar substrates separated by a predetermined gap, comprising:
at least one bond wire arranged across said gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate; at least one open stub arrangement configured on said first side of each said respective substrate, each said open stub arrangement comprising a microstrip extending at an angle from an end of each said conducting strip on each respective substrate; a ground layer on a second side of each respective substrate; a defected ground structure arranged on said second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on said first side. |
地址 |
Stockholm SE |