发明名称 |
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC APPARATUS |
摘要 |
The present disclosure relates to a solid-state imaging device and a manufacturing method of the same, and an electronic apparatus, capable of more reliably suppressing occurrence of color mixing.;A trench is formed between PDs so as to be opened to a light receiving surface side of a semiconductor substrate on which a plurality of the PDs, each of which receives light to generate charges, are formed, an insulating film is embedded in the trench and the insulating film is laminated on a back surface side of the semiconductor substrate. Then, a light shielding portion is formed so as to be laminated on the insulating film and to have a convex shape protruding to the semiconductor substrate at a location corresponding to the trench. The present technology can be applied to a back surface irradiation type CMOS solid-state imaging device. |
申请公布号 |
US2016211289(A1) |
申请公布日期 |
2016.07.21 |
申请号 |
US201615085305 |
申请日期 |
2016.03.30 |
申请人 |
SONY CORPORATION |
发明人 |
Miyanami Yuki |
分类号 |
H01L27/146;H04N5/378;H04N5/357 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. An imaging device, comprising:
a semiconductor substrate including:
first and second photoelectric conversion units, anda trench disposed between the first photoelectric conversion unit and the second photoelectric conversion unit; an insulating film disposed at a light-receiving side of the semiconductor substrate; and a light-shielding portion, wherein,
the first photoelectric conversion unit is adjacent to the second photoelectric conversion unit,the insulating film includes a substantially V-shaped portion at a location corresponding the trench, andthe light-shielding portion is disposed above the substantially V-shaped portion of the insulating film. |
地址 |
Tokyo JP |