发明名称 WIRE BONDING APPARATUS, AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING IT
摘要 PURPOSE:To obtain a stable wire tension and to enhance a maintenance property by a method wherein a tension-giving mechanism is constituted in such a way that a gas flows along one guide sheet. CONSTITUTION:A tension-giving mechanism 30 is constituted of the following: a nozzle 31 directed toward a wire 1; and one guide sheet 33 installed along the flow direction of a gas which is jetted from a jet orifice 32 formed in the nozzle 31. By using the tension-giving mechanism 30, the gas flows along the guide sheet 33 from the jet orifice 32 formed in the nozzle 31. Consequently, a tension is given to the wire 1 in the flow direction of the gas; the wire 1 is pressed to the guide sheet 33 by a pressure force of the gas ; a prescribed wire tension can be obtained stably. The contamination state of the guide sheet 33 is detected easily, a cleaning operation can be executed simply and a maintenance property can be increased.
申请公布号 JPH0411746(A) 申请公布日期 1992.01.16
申请号 JP19900114781 申请日期 1990.04.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 NAKASU YASUFUMI
分类号 H01L21/60 主分类号 H01L21/60
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