发明名称 |
Plastic electronic device structures with embedded components |
摘要 |
Circuitry such as electrical components and wires and traces on flexible printed circuits can be embedded within injection-molded plastic structures. The electrical components can include integrated circuits, connectors, and system-in-package circuit modules. The system-in-package circuit modules may include components mounted on a substrate and covered with plastic. The connectors may include a connector for mating with a corresponding connector on an electronic device or a battery. The injection-molded plastic structures may form a housing. The housing may form part of an electronic device, an external case that receives an electronic device, or other structures. A near-field communications antenna may be embedded within a plastic housing. Signal wires and plastic fibers may be interlaced to form a mesh that is embedded in the plastic housing or other injection molded plastic structure. |
申请公布号 |
US9496602(B2) |
申请公布日期 |
2016.11.15 |
申请号 |
US201414263749 |
申请日期 |
2014.04.28 |
申请人 |
Apple Inc. |
发明人 |
Kasar Darshan R. |
分类号 |
H05K1/00;H05K1/18;H05K7/00;H01Q1/24;H05K3/28;H05K9/00;H01Q1/42 |
主分类号 |
H05K1/00 |
代理机构 |
Treyz Law Group, P.C. |
代理人 |
Treyz Law Group, P.C. ;Treyz G. Victor;Hadd Zachary D. |
主权项 |
1. A case configured to receive an electronic device, comprising:
a connector that mates with a corresponding connector in the electronic device; an injection-molded plastic body; a flexible printed circuit that is at least partially embedded within the injection-molded plastic body and that is coupled to the connector; an electrical component mounted to the flexible printed circuit; and a metal electromagnetic interference shield that is mounted to the flexible printed circuit and embedded within the injection-molded plastic body, wherein the metal electromagnetic interference shield surrounds and shields the electrical component. |
地址 |
Cupertino CA US |