发明名称 Plastic electronic device structures with embedded components
摘要 Circuitry such as electrical components and wires and traces on flexible printed circuits can be embedded within injection-molded plastic structures. The electrical components can include integrated circuits, connectors, and system-in-package circuit modules. The system-in-package circuit modules may include components mounted on a substrate and covered with plastic. The connectors may include a connector for mating with a corresponding connector on an electronic device or a battery. The injection-molded plastic structures may form a housing. The housing may form part of an electronic device, an external case that receives an electronic device, or other structures. A near-field communications antenna may be embedded within a plastic housing. Signal wires and plastic fibers may be interlaced to form a mesh that is embedded in the plastic housing or other injection molded plastic structure.
申请公布号 US9496602(B2) 申请公布日期 2016.11.15
申请号 US201414263749 申请日期 2014.04.28
申请人 Apple Inc. 发明人 Kasar Darshan R.
分类号 H05K1/00;H05K1/18;H05K7/00;H01Q1/24;H05K3/28;H05K9/00;H01Q1/42 主分类号 H05K1/00
代理机构 Treyz Law Group, P.C. 代理人 Treyz Law Group, P.C. ;Treyz G. Victor;Hadd Zachary D.
主权项 1. A case configured to receive an electronic device, comprising: a connector that mates with a corresponding connector in the electronic device; an injection-molded plastic body; a flexible printed circuit that is at least partially embedded within the injection-molded plastic body and that is coupled to the connector; an electrical component mounted to the flexible printed circuit; and a metal electromagnetic interference shield that is mounted to the flexible printed circuit and embedded within the injection-molded plastic body, wherein the metal electromagnetic interference shield surrounds and shields the electrical component.
地址 Cupertino CA US