SN PLATING MATERIAL AND METHOD FOR PRODUCING SAME

摘要

Provided are an Sn plating material having superior micro slide-movement abrasion resistance when being used as a material for insertable/removable connection terminals and the like, and a method for producing the Sn plating material. On a base material 10 formed of copper or a copper alloy, a Ni layer 16 is formed so as to have a thickness of 0.1-1.5 µm through electroplating, a Sn-Cu plating layer 12 in which a Cu-Sn alloy 12a and a Sn 12b are intermixed is formed so as to have a thickness of 0.6-10 µm through electroplating using a Sn-Cu plating bath in which the Cu content with respect to the total of Sn and Cu is 5-35 mass%, and then, if necessary, a Sn layer 14 is formed through electroplating so as to have a thickness not larger than 1 µm.