| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring board of high reliability, where the upper surface of each organic resin insulating layer is made flat and thin film wiring conductor layers having specified patterns can be formed accurately. SOLUTION: In a multilayer wiring board, organic resin insulting layers 2 having through-holes 8 and thin-film wiring conductor layers 3 are alternately laminated on a substrate 1 in a multilayered state, and the thin-film wiring conductor layers 3 positioned above and below interposing the organic resin insulating layer 2 between them are connected electrically via a through-hole conductor 9 formed on the inner wall of the through-hole 8 arranged on the organic resin insulating layers 2. The organic resin installing layer 2 is formed by making an organic resin precursor whose viscosity is 50-200 cps in a layered state and by having it cured. |
