发明名称 CHEMICALLY AMPLIFIED RESIST COMPOSITE FOR LIQUID IMMERSION PROCESSES, AND PATTERN FORMING METHOD USING IT
摘要 <P>PROBLEM TO BE SOLVED: To provide a chemically amplified resist composite to be used in liquid immersion processes that is improved in PEB temperature dependency and liquid immersion soaking in liquid immersion exposure, and a pattern forming method using it. <P>SOLUTION: This chemically amplified resist composite contains (A) resin which is decomposed by acid and becomes more soluble to an alkali developer, (B) a compound which generates acid when irradiated with active light or a radioactive ray, (C) a solvent, and (D) 1,000 ppm or more of a surfactant of a fluorine and/or a silicon systems. The pattern forming method uses this composite. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005234178(A) 申请公布日期 2005.09.02
申请号 JP20040042619 申请日期 2004.02.19
申请人 FUJI PHOTO FILM CO LTD 发明人 KANNA SHINICHI;INABE HARUKI;KANDA HIROMI
分类号 G03F7/039;G03F7/004;H01L21/027 主分类号 G03F7/039
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