发明名称 MANUFACTURE OF MULTILAYERED BOARD
摘要 PROBLEM TO BE SOLVED: To provide a simple manufacturing method of a multilayered board wherein the handling as a conductor foil is easy and flatness of the surface of a conductor foil of the outermost layer can be sufficiently ensured. SOLUTION: Conductor foils 30 having releasing films wherein conductor foils 31 for forming a pattern and releasing films 32 are previously separably stuck are arranged on both surfaces of an inner layer member 10 via prepreg 20, setting the conductor foils 31 inside. The inner layer member 10, the prepreg 20 and the conductor foil 30 having releasing films are collectively laminated by heating and pressing, with a pair of mirror plates 40, from outside the conductor foils 30 having releasing films.
申请公布号 JPH09214137(A) 申请公布日期 1997.08.15
申请号 JP19960013981 申请日期 1996.01.30
申请人 IBIDEN CO LTD 发明人 TAKADA TETSUJI
分类号 B32B7/06;B29C70/06;B29L9/00;B32B15/08;H05K3/46;(IPC1-7):H05K3/46 主分类号 B32B7/06
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