| 摘要 |
PROBLEM TO BE SOLVED: To obtain the mounting structure of a wiring substrate on which the transmission loss of high frequency signal is small, a signal can be transmitted without deterioration of characteristics, and the reflection, etc., of signal on a mounted part can be suppressed. SOLUTION: A wiring substrate 1, provided with a first signal transmission line 4 formed on the surface of the insulating substrate 2 made of dielectric material constituting a wiring substrate 1 where a semiconductor element 3 is housed or mounted, and a slot made in a ground layer 6 inside the insulating substrate 2, is mounted on the surface of the wiring layer of an external electric circuit substrate 7, the wiring layer is used as the second signal transmission line 8, and the first signal transmission line 4 of the wiring substrate 1 and the second signal transmission line 8 of the external electric circuit substrate 7 are electromagnetically coupled through the slot holes 5 of the wiring substrate 1. |
