APPARATUS AND METHOD FOR BONDING PART

摘要

The present invention aims to provide a bonding apparatus and a method for bonding, wherein a light-absorbing material is applied on a selected site on the objects to be bonded and rapid bonding at the selected site is achieved through the instantaneous heat of the light-absorbing material. To this end, the present invention comprises: a bonding agent coating unit, which applies a bonding agent to a selected site of a first object to be bonded; a light-absorbing material coating unit, which applies a light-absorbing material to a selected site of a second object disposed on the first object; a control unit, which generates operational signals for the bonding agent coating unit and light-absorbing material coating unit, and operational signals for a curing unit that cures the light-absorbing material; and a curing unit, which generates light having a certain wavelength to cure the light-absorbing material. Accordingly, the present invention can provide rapid bonding of objects through the instantaneous heat of the light-absorbing material by applying the light-absorbing material to a selected site on objects to be bonded and minimize damage on the component by generating heat only on the selected site to be bonded, shorten the process and time required for the process by using a laser for rapid bonding, and enable various bonding methods, such as the bonding of small areas, the bonding of large areas, and precision bonding, depending upon the size of the area that is coated with the light-absorbing material.