| 摘要 |
PROBLEM TO BE SOLVED: To control the location accuracy of the surface of a semiconductor wafer sucked to a placing section with a relatively high accuracy, by suppressing deformation of a placing surface of the placing section.SOLUTION: A vacuum chuck member performing vacuum suction of an object placed on a placing surface via a placing section includes: the placing section consisting of a porous ceramic body having a planar placing surface; and a support consisting of a dense ceramic body having an outer wall including an inner peripheral surface surrounding an outer peripheral surface of the placing section while facing the outer peripheral surface, and a base surface abutting against the opposite surface to the placing surface of the placing section. The inner peripheral surface includes: a first area continuous in the circumferential direction of the inner peripheral surface and abutting against the outer peripheral surface directly; and a second area arranged continuously in the circumferential direction of the inner peripheral surface, on the side closer to the base surface than the first area, separately from the outer peripheral surface.SELECTED DRAWING: Figure 1 |
