| 摘要 |
A method is provided for forming a bump (19) on an electrode (32) on a wiring board (31). On a wiring board (31), in a first region (17) including the electrode (32), a fluid (14) containing conductive particles (16) and a bubble generating agent is applied. Then, on a main plane (18) of a board (40) having an area larger than that of the first region (17), a board (40) whereupon a protruding plane (13) having an area equivalent to that of the first region (17) is arranged by having the protruding plane (13) face the first region (17) of the wiring board (31). Then, the fluid (14) is heated, and bubbles (30) are generated from the bubble generating agent contained in the fluid (14). ® KIPO & WIPO 2009 |
