Substrate structure having electronic components and method of manufacturing substrate structure having electronic components

摘要

The present invention relates to a substrate structure having electronic components and a method of manufacturing a substrate structure having electronic components and can reduce signal loss and internal resistance and improve process efficiency by bringing a first terminal of a first electronic component and a second terminal of a second electronic component in direct contact with each other or in direct contact with each other by solder to minimize a path between the electronic components.

主权项

1. A substrate structure having electronic components, comprising:
a substrate having one surface, the other surface opposite to the one surface, and a cavity formed by penetrating between the one surface and the other surface; a first circuit pattern and a second circuit pattern provided on the one surface of the substrate; a first electronic component of which a portion is inserted in the cavity and the remaining portion protrudes outside the cavity and having a first terminal formed on a surface; a filler for filling a space between the cavity and the first electronic component; a first surface treatment layer provided on an upper surface of the first terminal of the first electronic component; a second electronic component mounted on the one surface of the substrate and having a second terminal electrically connected to the first surface treatment layer; a second surface treatment layer provided on the upper surface of the second circuit pattern; and a third surface treatment layer provided on a lower surface of the second terminal, wherein an upper surface of the first electronic component is positioned higher than an upper surface of the substrate, wherein the first terminal is formed on the upper surface of the first electronic component; wherein the second terminal is provided in plurality, and some of the plurality of second terminals are coupled to the first terminal and a rest of the plurality of second terminals are coupled to the second circuit pattern; wherein the first surface treatment layer and the third surface treatment layer are in direct contact with each other by way of solder, and wherein the second surface treatment layer and the third surface treatment layer are in direct contact with each other by way of solder.