LIGHT-EMITTING DIODE DEVICE, MANUFACTURING METHOD THEREFOR, AND MOLD USED THEREFOR

摘要

A method for manufacturing a light-emitting diode device, according to the present invention, comprises: a first step of preparing a base mold (300) having a plurality of recessed accommodation parts (A); a second step of applying fluorescent resins (320) inside the accommodation parts (A); a third step of mounting, within the accommodation parts (A), light-emitting diode chips (10) having smaller widths than those of the accommodation parts (A) such that the fluorescent resins (320) are pushed up to the top over a gap between the lateral sides of the accommodation parts (A) and the light-emitting diode chips (10) so as to allow the lateral sides of the light-emitting diode chips (10) to be surrounded by the fluorescent resins (320), thereby simultaneously obtaining a plurality of individual light-emitting diode devices; and a fourth step of separating the light-emitting diode devices from the base mold (300).