| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device suitable for microfabrication and high integration of a semiconductor device in which a semiconductor chip and electronic components are mixedly mounted on a substrate and packaged. <P>SOLUTION: An island, a spacer layer 3, and a discrete element 4 are stacked on a resin substrate 2 in this order. Chip capacitors 8 are formed between pad electrodes 6 and the spacer layer 3 on a first surface of the substrate 2. Pad electrodes 5 and the pad electrodes 6 are connected by bonding wires 10. On a second surface of the substrate 2, bump electrodes 11 are formed, which are electrically connected to the pad electrodes 6 via wiring. The position of the uppermost surface of the semiconductor chip 4 from the first surface of the substrate 2, that is the position of the pad electrodes 5, is raised by the spacer layer 3. <P>COPYRIGHT: (C)2012,JPO&INPIT |
