| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting diode chip package capable of being manufactured by more simplified manufacturing steps and at a low production cost.SOLUTION: A light-emitting diode chip package 200 includes: a substrate 202; a light-emitting diode chip set 214 installed on the substrate 202 and integrally molded with a plurality of light-emitting diode chips 206A, 206B, 206C, and 206D; and at least two electrodes 204A and 204B installed on the substrate 202 and electrically connected to the light-emitting diode chip set 214.SELECTED DRAWING: Figure 2A |
