发明名称 WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To suppress crosstalk between adjacent signal lines.SOLUTION: A wiring board comprises: a substrate; a first wiring structure that is arranged above the substrate, that includes a first signal line, a second signal line, and a first ground line arranged sequentially and adjacently, and in which a distance between the first signal line and the second signal line is smaller than that between the second signal line and the first ground line; and a second wiring structure that is arranged above the first wiring structure, that includes a second ground line, a third signal line, and a fourth signal line arranged sequentially and adjacently, and in which a distance between the third signal line and the fourth signal line is smaller than that between the second ground line and the third signal line. A distance between the second signal line and the third signal line is larger than that between the second signal line and the second ground line and that between the first ground line and the third signal line.SELECTED DRAWING: Figure 3
申请公布号 JP2016157839(A) 申请公布日期 2016.09.01
申请号 JP20150035290 申请日期 2015.02.25
申请人 FUJITSU LTD 发明人 TASHIRO HIROKO;ISHIZUKA TAKESHI
分类号 H01L23/12;H05K1/02 主分类号 H01L23/12
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