| 摘要 |
The invention relates to a method for detaching a carrier substrate (3) from a substrate stack (1, 2), which is formed by the carrier substrate (3) and a product substrate (5) and a connecting layer (4, 4') connecting the carrier substrate (3) and the product substrate (5), wherein the connecting layer (4, 4') has an adhesion strength for connecting the carrier substrate (3) and the product substrate (5) and the adhesion strength is at least partially reduced by means of a beam (8, 8') of electromagnetic radiation directed at least predominantly at the connecting layer (4, 4'). The invention further relates to a corresponding device. |
