| 摘要 |
Methods and systems for controlling MEMS switches in an integrated circuit package are disclosed and may include controlling one or more arrays of MEMS switches utilizing a control chip. The arrays of MEMS switches and one or more circuit components may be integrated in and/or on a multi-layer package. The control chip may be bonded to the multi-layer package. The circuit components may be coupled to the arrays of MEMS switches via electrical traces embedded in and/or deposited on the multi-layer package. The control chip may be flip-chip bonded to the multi-layer package. The MEMS switches may be actuated electrostatically or magnetically. The circuit components may include integrated circuits, inductors, capacitors, surface mount devices, and/or transformers.
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