| 摘要 |
An LED is provided to obtain a uniform brightness by enlarging an irradiation area of the LED using a shielding layer. An LED includes an LED chip(10) and a shielding layer. The shielding layer(20) is formed on one light emissive surface of the LED chip. The length of the shielding layer is larger than that of the one light emissive surface of the LED chip. The shielding layer is capable of being installed on a package body of the LED chip. The shielding layer is made of a conductive material. The shielding layer includes at least one hole or slit. The LED chip uses one selected from a group consisting of a lamp type package structure, a PCB type package structure, a front light emissive type package structure, a lateral light emissive type package structure or a surface mounting type package structure. |
