| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device securing a clearance between adjacent wires at the corner part of a semiconductor chip that is mounted and wire-bonded on a wiring board and having high reliability. <P>SOLUTION: A semiconductor device is provided with: a semiconductor chip 101 with a plurality of electrodes 102 arranged along each side at the peripheral part of one principal plane; a wiring board 105 mounting a semiconductor chip 101 and having a plurality of electrodes 104 corresponding to the plurality of electrodes 102 arranged; and a wire 103 for electrically connecting the electrode 102 of the semiconductor chip 101 to the electrode 104 of the wiring board 105. In the semiconductor device, the electrodes 102 at the corner part of the semiconductor chip 101 are arranged in two layers in such a manner that they are each positioned in the inner and outer peripheries. Thereby, a clearance between the adjacent wires 103 can be secured even at the corner part of the semiconductor chip 101. Thus, wiring failures can be suppressed, and reliability can be improved. <P>COPYRIGHT: (C)2009,JPO&INPIT |
