| 摘要 |
The present invention relates to a leadframe and a non-lead package therewith. The non-lead package comprises a leadframe, a die and a molding compound. The leadframe has a frame and a die pad. The frame has a plurality of conducting portions. The frame has a first recess at inner portions of the conducting portions. The die pad has a second recess at the edges of the die. The die is disposed on the die pad. The second recess is formed around the edges of the die pad. By utilizing the second recess, the epoxy-bleeding problem can be improved so as to avoid die pad pollution and irregularity when the die is mounted on the die pad. Furthermore, the non-lead package of the invention does not need a spacer disposed between the die and the die pad. Therefore, the producing processes and cost can be reduced.
|
