| 摘要 |
PROBLEM TO BE SOLVED: To provide a photocurable thermosetting resin composition that is more excellent in developability, surface curability, resolution and solder heat resistance than the conventional ones and is capable of being developed with an alkali by a solventless and non-contact exposure system, to provide a cured product of the resin composition and to provide a printed wiring board.SOLUTION: The photocurable thermosetting resin composition capable of being developed with an alkali by a solventless and non-contact exposure system comprises (A) an active energy ray-curable resin wax produced by reacting a reaction product of (a) a novolac type epoxy compound and (b) an unsaturated monocarboxylic acid with (c) a saturated or unsaturated polybasic acid anhydride and reacting the saturated or unsaturated polybasic acid anhydride (c) which is unreacted and (d) a hydroxyl group-containing monomer to eliminate the saturated or unsaturated polybasic acid anhydride (c) which is unreacted, (B) a photopolymerization initiator or a mixture of a photopolymerization initiator and a sensitizer and (C) a thermosetting component.SELECTED DRAWING: None |
