发明名称 LOOP-BACK PROBE TEST AND VERIFICATION METHOD
摘要 A method is provided for using a loop-back test device to verify continuity between loop-back probes electrically connected to each other on a probe card, the loop-back test device including a first conductive region electrically connected to a substrate, a second conductive region electrically isolated from the substrate, the second conductive region spaced apart from the first conductive region such that when a first loop-back probe contacts the first conductive region a second loop-back probe contacts the second conductive region, The method includes placing the first loop-back probe in electrical contact with the first conductive region, and placing the second loop-back probe in electrical contact with the second conductive region. Continuity between the substrate and the second conductive region is then measured.
申请公布号 US2016377657(A1) 申请公布日期 2016.12.29
申请号 US201615188024 申请日期 2016.06.21
申请人 Integrated Technology Corporation 发明人 Schwartz Rodney E.;Geist John K.
分类号 G01R1/073;G01R31/28 主分类号 G01R1/073
代理机构 代理人
主权项 1. A method of using a loop-back test device to verify continuity between loop-back probes electrically connected to each other on a probe card, the loop-back test device including a first conductive region electrically connected to a substrate, a second conductive region electrically isolated from the substrate, the second conductive region spaced apart from the first conductive region such that when a first loop-back probe contacts the first conductive region a second loop-back probe contacts the second conductive region, the method comprising: placing the first loop-back probe in electrical contact with the first conductive region; placing the second loop-back probe in electrical contact with the second conductive region; and measuring continuity between the substrate and the second conductive region.
地址 Tempe AZ US
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