LUMINESCENT MODULE, AND ITS MANUFACTURING METHOD

摘要

Provided are a luminescent module, which is improved in the heat radiation and in the contact between a sealing resin for sealing a light emitting element and another member, and a method for manufacturing the module. The luminescent module (10) comprises a metal substrate (12), a recess (18) formed by recessing the upper face of the metal substrate (12) partially, a light emitting element (20) housed in the recess (18), and a sealing resin (32) for covering the light emitting element (20). On the upper face of a metal substrate (40) in the region enclosing the recess (18), moreover, there is formed a rising portion (11), with which the sealing resin (32) comes into contact, thereby to improve the contact strength between the sealing resin (32) and the metal substrate (12).