发明名称 LIQUID BLOW MOLDING APPARATUS AND LIQUID BLOW MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To propose a liquid blow molding apparatus and a liquid blow molding method which prevent the partial lowering of temperature of a preform or prevent displacement relative to a blow molding mold and suppress the occurrence of molding failure in liquid blow molding.SOLUTION: There is provided a liquid blow molding apparatus 11 in which a support pin 5 is arranged inside a blow molding mold, the support pin 5 comprises a head 6 and a shaft 7, wherein the support pin 5 is configured so that a clearance C between the head 6 and a bottom part P4 of a preform P is formed in a state where the preform P is set in the blow molding mold and configured to be lowered according to the deformation of the preform P by supporting a bottom part P4 of the preform P at the timing during the molding process.SELECTED DRAWING: Figure 1
申请公布号 JP2016210031(A) 申请公布日期 2016.12.15
申请号 JP20150093369 申请日期 2015.04.30
申请人 YOSHINO KOGYOSHO CO LTD 发明人 OKUYAMA YUICHI;TOYAMA KENICHI
分类号 B29C49/46;B29C49/06;B29C49/48 主分类号 B29C49/46
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