发明名称 |
LIQUID BLOW MOLDING APPARATUS AND LIQUID BLOW MOLDING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To propose a liquid blow molding apparatus and a liquid blow molding method which prevent the partial lowering of temperature of a preform or prevent displacement relative to a blow molding mold and suppress the occurrence of molding failure in liquid blow molding.SOLUTION: There is provided a liquid blow molding apparatus 11 in which a support pin 5 is arranged inside a blow molding mold, the support pin 5 comprises a head 6 and a shaft 7, wherein the support pin 5 is configured so that a clearance C between the head 6 and a bottom part P4 of a preform P is formed in a state where the preform P is set in the blow molding mold and configured to be lowered according to the deformation of the preform P by supporting a bottom part P4 of the preform P at the timing during the molding process.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016210031(A) |
申请公布日期 |
2016.12.15 |
申请号 |
JP20150093369 |
申请日期 |
2015.04.30 |
申请人 |
YOSHINO KOGYOSHO CO LTD |
发明人 |
OKUYAMA YUICHI;TOYAMA KENICHI |
分类号 |
B29C49/46;B29C49/06;B29C49/48 |
主分类号 |
B29C49/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|