发明名称 COMPONENT MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To improve productivity when mounting components on substrates, by providing a component mounting device with two substrate conveying devices each of which carries in and out a substrate, and performing proper control. <P>SOLUTION: A component transfer device having two component picking heads 43a and 43b picks components from component supply devices 45a and 45b and mounts them on substrates Sa and Sb carried in by two substrate conveying devices 10a and 10b respectively. The component transfer device having two component picking heads simultaneously mounts components on two substrates carried in by two substrate conveying devices when neither of two substrate conveying devices are conveying substrates nor are changing width, and the component transfer device mounts a component only on a substrate held in a component mounting position of one of two substrate conveying devices when the other substrate conveying device is conveying a substrate or is changing width. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009021640(A) 申请公布日期 2009.01.29
申请号 JP20080276175 申请日期 2008.10.27
申请人 FUJI MACH MFG CO LTD 发明人 SHIMIZU KOJI;TERUI SEIICHI
分类号 H05K13/04 主分类号 H05K13/04
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