发明名称 OPTO-ELECTRIC HYBRID BOARD
摘要 There is provided an opto-electric hybrid board in which a metal reinforcement layer is in intimate contact with an insulative layer of a flexible circuit board without an adhesive layer interposed therebetween, the metal reinforcement layer allowing the proper mounting of an element while deformation due to pressing load applied during the mounting is suppressed. In the opto-electric hybrid board, a flexible double-sided circuit board in which electrical interconnect lines are formed on the front and back surfaces of an insulative layer having flexibility is used as an electric circuit board. A metal reinforcement layer is formed by plating on at least part of the electrical interconnect line on the back surface side which corresponds to a mounting pad on the front surface side. An optical waveguide is formed in contact with the electrical interconnect line on the back surface side of the flexible double-sided circuit board.
申请公布号 US2016178839(A1) 申请公布日期 2016.06.23
申请号 US201414893245 申请日期 2014.03.31
申请人 NITTO DENKO CORPORATION 发明人 Tsujita Yuichi;Ishimaru Yasuto
分类号 G02B6/12;H05K1/02 主分类号 G02B6/12
代理机构 代理人
主权项 1. An opto-electric hybrid board comprising: a flexible double-sided circuit board including an insulative layer,a front electrical interconnect line having a mounting pad, the front electrical interconnect line being formed on a front surface side of the insulative layer, anda back electrical interconnect line formed on a back surface side of the insulative layer; an element mounted on the mounting pad; an optical waveguide stacked on the back surface side of the insulative layer; and a metal reinforcement layer formed by plating on at least a part of the back electrical interconnect line which corresponds to a position of the mounting pad, wherein the optical waveguide is in contact with the metal reinforcement layer.
地址 Osaka JP