SALICIDE FORMATION ON REPLACEMENT METAL GATE FINFET DEVICES

摘要

A fin field effect transistor (finFET) device and a method of fabricating a finFET are described. The method includes forming a replacement gate stack on a substrate between inside walls of sidewall spacers, epitaxially growing a raised source drain (RSD) on the substrate adjacent to outside walls of the sidewall spacers, and forming a silicide above the RSD and along the outside walls of the sidewall spacers. The method also includes depositing and polishing a contact metal above portions of the replacement gate stack and the RSD, the contact metal contacting the silicide along the outside walls of the sidewall spacers adjacent to the portions of the replacement gate stack.

主权项

1. A method of fabricating a fin field effect transistor (finFET) device, the method comprising:
forming a replacement gate stack on a substrate between sidewall spacers, wherein an inside wall of each sidewall spacer contacts the replacement gate stack; epitaxially growing a raised source drain (RSD) on the substrate adjacent to outside walls of the sidewall spacers, wherein the outside wall of each sidewall spacer is on an opposite side of the respective inside wall of the sidewall spacer; forming a silicide above the RSD and along the outside walls of the sidewall spacers; and depositing and polishing a contact metal above a portion of the replacement gate stack and the RSD, the depositing including the contact metal contacting the silicide along the outside walls of the sidewall spacers adjacent to the portion of the replacement gate stack.