发明名称 SOLDERING METHOD
摘要 PURPOSE:To prevent the splash of a flux and the massing of a solder with faster treating speed by depositing and adhering the powdery solder coated by a flux with heating a soldered part and by performing a soldering with abutting to the side of a counterpart. CONSTITUTION:The soldering part of the metal member of which a soldering is performed is heated to the depositing temp. of a flux, which is deposited and adhered on the heated part with touching the powdery solder coating its surface with a flux. A soldering is performed by bringing the soldered part being coated with this flux coated powdery solder into contact with the metal part of the counterpart side to be soldered and by heating it. There is therefore no part having an adhesion excepting the adhered part of a flux and no excess solder is adhered.
申请公布号 JPS6199565(A) 申请公布日期 1986.05.17
申请号 JP19840220149 申请日期 1984.10.19
申请人 TARUCHIN KK 发明人 MASUZAWA MASAO;TANAKA HARUTOSHI
分类号 B23K3/06;B23K1/00;H05K3/34;(IPC1-7):B23K1/00 主分类号 B23K3/06
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