发明名称 CONDUCTIVE ADHESIVE
摘要 PURPOSE:To yield a conductive adhesive with improved bonding time, bond strength, and resistance to heat and solvents, by dispersing a conductive material in a hot-melt adhesive. CONSTITUTION:A conductive material is dispersed in a hot-melt adhesive. Polyester, polyamide, polyurethane, polyolefin resins and the like are used as the hot-melt adhesive. Conductive carbon may be used as the conductive material and, in addn., carbon fiber filler, conductive carbon, and metallic powder such as nickel powder or copper powder, or a mixture of two or more components selected from these materials may also be used. Since the conductivity of the adhesive depends upon the amt. of the conductive material added, the conductivity of the adhesive can be controlled by the amt. of the conductive material to be incorporated. In incorporation of conductive carbon, additional ethylene copolymer, block copolymer, etc., makes dispersion of the conductive carbon favorable.
申请公布号 JPS61151283(A) 申请公布日期 1986.07.09
申请号 JP19840272539 申请日期 1984.12.24
申请人 DAINIPPON PRINTING CO LTD 发明人 YAMAGISHI HIDEHARU
分类号 C09J11/04;H05K3/32 主分类号 C09J11/04
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