发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:The title resin composition improved in the impact resistance, cracking resistance and heat resistance of a cured product, prepared by mixing an epoxy resin with an acid anhydride, a specified polymerizable monomer and a radical polymerization initiator. CONSTITUTION:An epoxy resin (A) having at least two epoxy groups in the molecule is mixed with an acid anhydride (B), a polymerizable monomer (C) having both of a carboxyl group and a radical-polymerizable double bond in the molecule and a radical polymerization initiator (D). Component A includes bisphenol A or bisphenol F-derived epoxy resin, component B includes phthalic anhydride and maleic anhydride, component C includes acrylic acid and methacrylic acid, and component D includes benzoyl peroxide and azobisisobutyronitrile. The mixing ratio of said thermosetting resin composition is such that 0.3-1.4 equilvant of component B, 0.1-1.6 equivalent (in terms of carboxyl groups) of component C are present per equivalent of component A and 0.1-5pts.wt. component D is present per 100pts.wt. component C.
申请公布号 JPS61235425(A) 申请公布日期 1986.10.20
申请号 JP19850077192 申请日期 1985.04.11
申请人 HITACHI CHEM CO LTD 发明人 KAGEYAMA AKIRA;YOSHIOKA EMIKO
分类号 C08G59/00;C08G59/40;C08G59/42;C08G59/68;C08L63/00 主分类号 C08G59/00
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