| 摘要 |
PURPOSE:To dissipate the heat efficiently regardless of the dispersion of fixing height of integrated circuit elements by a method wherein multiple integrated circuit elements on a wiring substrate is encircled by a frame body to be filled with a heat transfer material while the surface of heat transfer material is flattened to bond a cooling down sheet thereon. CONSTITUTION:A frame body 3 is fixed on a wiring substrate 2 as if encircling multiple circuit elements 1 on the wiring substrate 2. This frame body 3 is filled with a heat transfer material 4 as if covering all integrated circuit elements 1 inside the frame body 3 having flat surface. As for the soft heat transfer material 4, a heat transferable bonding material to be rubber-like or gelatinous after setting or heat transferable compound in relatively high viscosity are applicable. A cooling down sheet 5 is formed into the same dimension as longitudinal and lateral width creeping into the frame body 3 to be bonded onto the surface of heat transfer material 4. Besides, a refrigerant feeding pipe 6 is brazed onto the cooling down sheet 5.
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