| 摘要 |
PURPOSE: To connect the bump of a LSI chip to a board electrode by using composition represented by a given formula and containing preset amount of conductive powder and organic binder. CONSTITUTION: Composition, represented by a general formula, Agx (0.001<=x<=0.4, x=atomic percentage), has higher silver concentration on the surfaces of particles than average silver concentration and an area where the silver concentration is increased near the surfaces of particles, gradually toward the surface. It contains 0.03-10wt.% organic binder, in terms of 1wt.pts. conductive powder containing 40vol.% or more particles of average size 2-40μm±2μm. Such composition is used to connect the bump of a LSI chip to a board electrode. |
