发明名称 銅薄膜付基材用アンダーコート剤、銅薄膜付基材及び銅薄膜付基材の製造方法、並びに導電性フィルム
摘要 An objective of the invention is to provide an undercoat. The undercoat has excellent initial-stage adhesion, acid-resisting adhesion, and alkali-resisting adhesion with a base material and a copper film. The invention relates to an undercoat of a base material with a copper film. The undercoat contains acrylic copolymer (A) with hydroxyl, alkyl ester groups, nitrile groups, and required primary amide groups, polyisocyanates (B) at least containing three isocyanate groups, an active energy line aggregate compound (C) at least containing three carbon-carbon double bond groups, and a reactive alkoxy silyl group compound (D) represented by a formula (1): X1-Si(R1)a(OR2)3-A, wherein in the formula (1), X1 is a group containing the following functional groups, the functional groups react with at least a group selected from a group formed by hydroxyl, isocyanate groups, and groups containing polymeric carbon-carbon double bonds, R1 represents hydroxyl with 1-9 hydrogen or carbon number, R2 represents hydroxyl with 1-8 carbon number, and a represents 0, 1, or 2.
申请公布号 JP6011895(B2) 申请公布日期 2016.10.25
申请号 JP20150191069 申请日期 2015.09.29
申请人 荒川化学工業株式会社 发明人 山崎 彰寛;東本 徹;近藤 洋平
分类号 C09D133/00;B32B15/08;B32B15/095;C09D4/00;C09D5/00;C09D133/20;C09D133/26;C09D175/04 主分类号 C09D133/00
代理机构 代理人
主权项
地址