CONDUCTIVE ADHESIVE AND CIRCUIT USING THE ADHESIVE

摘要

PROBLEM TO BE SOLVED: To provide a conductive adhesive free from migration and having little resistance change even after leaving at high temperature by using a metal which is easily available and causing no environmental pollution and to provide a circuit using the adhesive. SOLUTION: This conductive adhesive is obtained by compounding (A) conductive particles prepared by coating the surfaces of metallic particles whose surface is nickel or an alloy of nickel and boron with a mixture of a polyoxyalkylenephosphoric acid ester derivative and a polyoxyalkylenealkylamine (polyoxyalkylenealkenylamine) or its derivative, (B) an epoxy resin containing 20-70wt.% diglycidyl-type reactive diluent and (C) a phenolic resin-based curing agent containing >=50wt.% alkylresol-type or alkylnovolak-type resin.