Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection,申请号US20010927164-传众专利搜索

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发明名称	Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection
摘要	A thermal conductive sheet including at least 70-95 weight parts of inorganic filler and 5-30 weight parts of thermosetting resin composition and having flexibility in an uncured state is prepared. Through-holes are formed in the thermal conductive sheet and a conductive resin composition is filled in the through-holes. The thermal conductive sheet and a semiconductor chip are overlapped to match positions of the through-holes formed in the thermal conductive sheet with those of the electrodes formed on the semiconductor chip. The thermal conductive sheet and the semiconductor chip are compressed while being heated and the thermal conductive sheet is cured and integrated with the semiconductor chip. An external lead electrode is formed on the thermal conductive sheet at a side opposite to the surface where the semiconductor chip is overlapped, and that is connected with the conductive resin composition. According to the above-mentioned configuration, a semiconductor package that is not required to be sealed by resin, and is excellent in reliability, air-tightness and thermal conductivity can be realized.
申请公布号	US2002028536(A1)	申请公布日期	2002.03.07
申请号	US20010927164	申请日期	2001.08.10
申请人	MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.	发明人	HIRANO KOICHI;NAKATANI SEIICHI
分类号	H01L21/48;H01L21/60;H01L23/13;H01L23/29;H01L23/31;H01L23/373;H01L23/498;(IPC1-7):H01L21/44;H01L21/50	主分类号	H01L21/48
代理机构		代理人
主权项
地址

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