PACKAGE FOR INCORPORATING AN INTEGRATED CIRCUIT AND A PROCESS FOR THE PRODUCTION OF THE PACKAGE

摘要

The invention relates to a package for incorporating an integrated circuit comprising a plate (1) substantially consisting of a plastic and of electrically conductive material, which plate is at least partly provided with an upright side with at least one contact point, characterized in that the upright side contains a plastic, while the electrically conductive material is applied in the form of layers (3, 4) on the plate and on the upright sides. Such a package no longer has a separate lead frame, so that the pin count is no longer limited by the lead frame. Further, owing to the design of the package, thermal fatigue is no longer critical. The packages are suited for incorporating integrated circuits and other discrete parts and/or electronic components. The packages are highly suited for stacked applications such as memory modules. The invention also relates to the process for producing such packages. The packages can be produced using an injection moulding technique, or using a mechanical and/or thermal/mechanical moulding technique in combination with a technique for applying the electrically conductive material.