| 摘要 |
<p>PURPOSE:To reduce manufacturing cost by cutting down the number of components and simplifying assembly, and to improve the reliability of a device by strengthening the bonding state of components. CONSTITUTION:A lead frame wherein the I/O terminal of a light emitting element 21 to the outside and the I/O terminal of a light receiving element 31 to the outside are arranged by collecting them in a connector connection part is formed, and both of the light emitting element and the light receiving element are mounted on the same lead frame, which is directly connected with a connector for external connection. Welding pins 51', 52' which are composed of thermoplastic resin and bond a sheath holder 5 to a connector 4 and the lead frame 1 by being thermally caulked are laid on the sheath holder 5 containing a light emitting.receiving member 6.</p> |
