| 摘要 |
PURPOSE:To automatically and rapidly solder an electrically conductive terminal to a plate glass face by positioning the electrically conductive terminal in other place and moving the terminal to a soldering position by a moving apparatus having a specific structure. CONSTITUTION:Plate glass 7 to which an electrically conductive terminal 1 is soldered is put on a placing table 8 and positioned by a pusher 9. An electrically conductive terminal 1 to which lead wire is pressed is separately accurately positioned by a positioning device 2. Then, a cylinder 32 for rotating a moving device 3 is operated and an arm 34 is rotated by contraction of a rod 33 and a holding means 4 is moved at the position of the positioning device 2 and a cylinder 36 for lifting and lowering is operated to lower the holding means 4. Then, a terminal part of the electrically conductive terminal 1 is held by the holding means 4 and raised and rotated and moved right above a soldering position on the plate glass 7 and then, lowered to press the electrically conductive terminal 1 to an electrically conducted material formed on the upper face of the plate glass 7. Then, hot air is fed from a heater 5 and the electrically terminal 1 is soldered to the electrically conductive material. |
