| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability concerning temperature cycle and moisture resistance or the like, by preventing cracks due to air (void) and improving adherence between a board and resin, in a semiconductor device of a BGA(ball grid array) type. SOLUTION: A chip 5 which is electrically connected with a wiring 2 arranged on a board formed of a TAB tape 1 via a bump 6 is mounted, and a region containing the chip 5 and the wiring 2 or the like are sealed with resin 7. Regarding the TAB tape 1 forming the board, a penetrating hole 8 for dispersing the air (void) is formed in the central part of the TAB tape 1 in the vicinity of the mounting area of the chip 5, in which part air (void) included in the resin 7 is apt to gather at the time of resin sealing. A plurality of through holes 3 corresponding to external solder balls 4 are further arranged on the TAB tape 1, and a semiconductor device of a BGA type is constituted. |
