| 摘要 |
A wiring lay-out is provided, for electrically connecting a decoupling cap on a front surface of a multilayer printed circuit board (e.g., a motherboard), with a surface-mounted electrical component (e.g., a micro-ball grid array packaged semiconductor device, such as a PC core logic chip set) on the front surface of the printed circuit board. The wiring lay-out includes a wiring portion formed from a copper plane on the front surface of the printed circuit board; this wiring portion, providing electrical connection from one of the balls of the ball grid array to the decoupling cap, is provided only on the front surface of the printed circuit board. In order to provide a route for the wiring between the electrical component and decoupling cap, vias through the printed circuit board are positioned in a row with bonding pads. All decoupling caps on the printed circuit board are provided on the front surface of the printed circuit board.
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