发明名称 多層構造体、インターポーザ、および、インターポーザの製造方法
摘要 A multilayer structure which comprises an anisotropic conductive member (2), first metal layers (4) that are arranged on both surfaces of the anisotropic conductive member (2), and second metal layers (5) that are arranged on the surfaces of the first metal layers (4). The anisotropic conductive member (2) is a metal filled structure having a plurality of conduction paths (7) which are formed by filling a plurality of micropores of an insulating base with a conductive material, said insulating base is formed of an anodic oxide film of an aluminum substrate. The constituent material of the first metal layers (4) contains at least one metal material selected from the group consisting of titanium, nickel, chromium and alloys of these metals. A metal material that constitutes the second metal layers (5) is different from the metal material that is contained in the first metal layers (4).
申请公布号 JP6055552(B2) 申请公布日期 2016.12.27
申请号 JP20150538938 申请日期 2014.05.07
申请人 富士フイルム株式会社 发明人 山下 広祐
分类号 H01R11/01;H01L23/32;H01R43/00;H05K1/14;H05K3/32 主分类号 H01R11/01
代理机构 代理人
主权项
地址