| 摘要 |
PURPOSE:To prevent the contamination and the damage of the surface of a semiconductor device by interposing a semiconductor pellet stabilized on the surface between elastic sealing materials, filling and curing coating material in the air gap between the sealing materials and coating a pellet. CONSTITUTION:Heat dissipating spacers 11 and 12 are secured to both surfaces of a semiconductor pellet 10 stabilized in advance on the surface. The pellet is placed through a coating material flow preventing frame 16 between a pair of upper and lower pressing dies 14 and 15 having elastic sealing materials 13 on the faced surfaces. Pressure P is applied from both surfaces of the pressing dies to slightly submerge the spacers 11, 12 partly in the sealing material 13. Thereafter, the coating material 17 is filled in the air gap, is then heated to cure the coating material, and the die 14 and the frame 16 are removed. In this manner, secondary discharge and damage can be prevented due to the contamination on the surface. |
