发明名称 HIGH-FREQUENCY CERAMIC BGA PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency ceramic BGA package for high jointing strength, in which no peeling or cracks are caused, even if it is bonded to a ceramic by using a metal ball of superior thermal conductivity, whose thermal expansion coefficient is different from that of the ceramic. SOLUTION: Related to a high-frequency ceramic BGA package 10 for provided with an external connection terminal 13 for electrically connecting to the outside that is jointed to an external connection terminal pad 12 of metal conductor, formed by sintering simultaneously with a ceramic green sheet, the external connection terminal 13 is constituted of a spherical metal ball of Cu. The metal ball is jointed to the external connection terminal pad 12 with a high-temperature wax 14. The high-temperature wax 14 is formed slanted on the external connection terminal pad 12 to have a wide skirt in cross-sectional view. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003303925(A) 申请公布日期 2003.10.24
申请号 JP20020109089 申请日期 2002.04.11
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 KOSAKATA AKIYOSHI
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
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