| 摘要 |
PURPOSE:To accurately bond an LSI by correcting the detected position of an island of a semicondcutor device enclosure at preset position and bonding it while confirming the predetermined position with the corrected island position as reference. CONSTITUTION:The lead frame of a semiconductor device enclosure is detected by a television camera, and converted into binary. The center of the island position of the lead frame is calculated with the binary signal as the basis, an error with the central value stored in advance is calculated, the island position of the television camera is corrected with this value, and it is set as a reference. It is bonded while confirming the respective inner lead wires. |
