Energy-sensitive resin composition

摘要

The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.

主权项

1. An energy-sensitive resin composition comprising polyamic acid, a solvent, and a compound (A), wherein the polyamic acid is obtained by reacting tetracarboxylic dianhydride with diamine, the compound (A) comprises at least one of:
a compound (A-1) that decomposes by the action of at least one of light and heat and generates an imidazole compound; and an oxime ester compound (A-2),
wherein the compound (A-1) is represented by the following formula (4) or a compound represented by the following formula (6), andthe oxime ester compound (A-2) is represented by the following formula (11),wherein R1, R2 and R3 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a phosphino group, a sulfonato group, a phosphinyl group, a phosphonato group, or an organic group; R4 and R5 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, or an organic group; R6, R7, R8, R9 and R10 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, an ammonio group, or an organic group; provided that neither R6 nor R7 is a hydroxyl group; and two or more of R6, R7, R8, R9 and R10 optionally join together to form a cyclic structure, or optionally include a bond of a heteroatom;wherein R1, R2 and R3 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a phosphino group, a sulfonato group, a phosphinyl group, a phosphonato group, or an organic group; and R12 represents an optionally substituted hydrocarbon group; wherein R13 represents an alkyl group having 1 to 10 carbon atoms, an optionally substituted phenyl group or an optionally substituted carbazolyl group; and p is 0 or 1; R14 represents an optionally substituted alkyl group having 1 to 10 carbon atoms or an optionally substituted phenyl group; R15 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or an optionally substituted phenyl group.